[Edaily Reporter Lee Hye-ra] #Sonicx, a company specializing in communication RF filters and photonics foundry servicesSonicx announced on the 10th that it will unveil a prototype of an ultra-compact filter based on High-K single-crystal Lithium Niobate (LN) for the next-generation 30GHz millimeter-wave (mmWave) band at "IMS 2026" (IEEE MTT-S International Microwave Symposium 2026), the world's largest microwave and RF technology exhibition.

The unveiled product leverages the high permittivity (High-K) and low dielectric loss characteristics of single-crystal LN substrates to achieve both groundbreaking miniaturization and low-loss performance compared to existing PCB, LTCC, and CMOS-based mmWave filters. It is capable of supporting key frequency bands for next-generation 5G Advanced, 6G, satellite communications, and defense and aerospace sectors.
Recently, the next-generation wireless communications market has demanded the use of higher frequency bands and greater system integration. However, in the mmWave range, component size, transmission loss, and thermal stability have been identified as technical challenges.
Sonicx has overcome these limitations by leveraging its proprietary single-crystal material application technology and high-frequency design capabilities to develop a next-generation RF filter platform that simultaneously delivers high performance and ultra-compact size. This prototype was designed to achieve excellent frequency selectivity and low signal loss in the 30 GHz band, and is expected to contribute to the miniaturization and high integration of future RF front-end modules.
Yang Hyung-kook, CEO of Sonix, stated, “The unveiling of this prototype is a significant milestone demonstrating the global competitiveness of next-generation mmWave materials and component technologies developed in Korea.” He added, “We plan to actively enter high-growth markets such as 6G communications, satellite communications, and defense radar through customer evaluations and joint development.”
Sonicx intends to use this exhibition as an opportunity to expand cooperation with global telecommunications equipment companies, semiconductor firms, and research institutions, and to accelerate its commercialization roadmap.