[Edaily Reporter Shin Ha-yeon] KOSDAQ-listed company #Taesung is participating in "JPCA Show 2026," Japan's largest PCB and electronic circuit industry exhibition, to showcase its next-generation glass substrate (TGV) process technology and expand into the global market.
Taesung announced on the 10th that it will introduce TGV (Through Glass Via) etching technology—a core technology in glass substrate manufacturing—and related process solutions at the JPCA Show 2026, taking place from the 10th to the 12th of this month at Tokyo Big Sight in Japan. Taesung’s booth at the JPCA Show. (Photo courtesy of Taesung) The JPCA Show is a leading exhibition in the PCB and electronic circuit industry, attracting a large number of global electronics and materials companies as well as semiconductor packaging firms. With the recent expansion of the AI semiconductor, High Bandwidth Memory (HBM), and advanced packaging markets, interest in glass substrate technologies—which are gaining attention as next-generation substrates—is also growing.
TGV is a process that forms micro-through-holes within glass substrates and is regarded as an essential technology for realizing next-generation semiconductor packaging. The industry forecasts that the adoption of glass substrates—which are expected to replace existing organic substrates—will expand in line with the increasing performance of AI semiconductors and growing data processing demands. Major global companies are also reportedly pushing for commercialization around 2027.
During the exhibition, Taesung plans to hold technical meetings with major semiconductor packaging and PCB companies from Japan, Taiwan, and China to explore new business opportunities. The company has recently been expanding its development of glass substrate-related technologies and its engagement with clients, and plans to accelerate the supply of process equipment and the acquisition of new customers in line with future market growth.
A company official stated, “Glass substrates are gaining attention as next-generation substrate technology driven by the growth of the AI semiconductor and advanced packaging markets,” adding, “Through this JPCA Show, we plan to actively promote our TGV process technology and business capabilities to global customers and proactively respond to market expansion.”
Electric bicycles, which once experienced sluggish growth, have established themselves as a core growth driver for SAMCHULY BICYCLE CO., LTD(024950), a leading domestic bicycle manufacturer. The compa…
Pulmuone Corporate is accelerating its push into the U.S. market by prioritizing its “authentic Korean kimchi” strategy. Thanks to a combination of this strategy and localized marketing efforts—such a…
“I once survived a car accident in which my vehicle was totaled. At the time, I was driving a Volvo. My goal is to build a brand that earns the trust of customers who choose KTCorporation, so they bel…
