[E-Daily Reporter Kim Se-yeon ] HANMISemiconductorCO.,Ltd.(042700), a leading domestic semiconductor equipment company, announced on the 14th that its operating profit (on a consolidated basis) for the second quarter of this year rose 51% year-over-year to 130.3 billion won. Revenue for the same period increased 39.5% to 251.2 billion won.

HANMISemiconductorCO.,Ltd.’s second-quarter revenue marks a record high on a quarterly basis. The company attributes this to rapidly growing demand for TC bonders and MSVP (Micro Saw & Vision Placement) equipment for High-Bandwidth Memory (HBM), driven by increased investment in production facilities by global semiconductor companies amid the expansion of the AI market.
HANMISemiconductorCO.,Ltd. recently launched three new types of 2.5D packaging equipment for AI system semiconductors and has supplied them to leading global foundry and back-end process customers.
The company is also accelerating its efforts to secure a leading position in the next-generation HBM market. It plans to unveil a prototype of its “second-generation hybrid bonder” by the end of this year and launch a “wide TC bonder” in the first half of next year to prepare for future market demands. The second-generation hybrid bonder is designed to meet the mass production of HBM with 16 layers or more, which is expected around 2029.
HANMISemiconductorCO.,Ltd. stated, “In line with recent trends in the AI semiconductor industry, we plan to accelerate the supply of our new 2.5D packaging equipment,” adding, “We will continue our steady growth by timely supplying cutting-edge, customized equipment to the increasingly sophisticated AI packaging market.”