[Edaily Reporter Han Kwangbeom ] Choi Seok-ho, Principal Researcher at LG Electronics ( LGELECTRONICS(066570) ), and Yoon Choi, CEO of GMZECO, were awarded the August “Korea Engineer Award.”

The Ministry of Science and ICT and the Korea Industrial Technology Promotion Association announced the selection of the August recipients of the “Korea Engineer Award” on the 10th.

Choi Seok-ho, a senior researcher at LGELECTRONICS’ ES Research Lab, is an expert in airflow optimization who has spent the past 22 years researching high-efficiency, low-noise fan design technology at LGELECTRONICS. LGELECTRONICS operates 27 corporate research institutes recognized by the Ministry of Science and ICT—including those focused on system air conditioners, component solutions, and air science—and has contributed to securing the technological competitiveness of the nation’s electronics industry.

Senior Researcher Choi developed a biomimetic flow control design that applies the protrusions found on humpback whale fins and the ribbed structure of scallops to the surfaces of fans in HVAC appliances such as air conditioners and air purifiers. The protrusions on humpback whale fins generate turbulence to suppress air separation, while the fan-shaped scallop shell structure blocks radial flow to prevent slip. As a result, the team achieved a 20% increase in maximum airflow at the same noise level and a 20% reduction in power consumption.

These research findings have led to significant improvements in the core performance of commercial products, including a 20% increase in the cooling capacity of air conditioners compared to previous models.

Principal Researcher Choi Seok-ho stated in his acceptance speech, “Based on innovative fluid dynamics technology, we will continue to enhance the competitiveness of various HVAC products and do our utmost to promote the use of domestically produced products in the rapidly growing data center cooling market.”

Yoon Choi, CEO of GMZECO and a co-recipient of the award, is a professional executive who has been engaged in research and development of power semiconductor packaging since 1993 and is leading the localization of power semiconductor processes based on over 200 domestic and international patents. Since being recognized as an in-house research institute by the Ministry of Science and ICT in 2013, GMZECO has continuously strengthened its technological innovation capabilities by participating in government R&D projects.

CEO Choi developed 3D clip bonding technology, which connects chips to substrates using copper conductors (clips) instead of conventional thin wires, and commercialized high-thermal-conductivity, high-efficiency power semiconductor packaging. This technology reduces electrical resistivity by more than 60% and improves thermal conductivity by more than 50% compared to existing products. GMZECO supplies its technology to global semiconductor companies such as TI, UTAC, Amkor, and ON Semiconductor, achieving $10 million in exports last year.

This achievement was highly praised for simultaneously enabling the miniaturization of power semiconductors, improving energy efficiency, reducing high-voltage power losses, and lowering manufacturing costs through the application of ultrasonic welding technology.

CEO Yoon Choi stated, “Based on our research capabilities, we have grown into a leading company in the power semiconductor sector, and we will continue to strengthen our competitiveness in the global market by establishing a domestic power semiconductor supply chain.”