[Edaily Reporter KIM AH-REUM ] HANMISemiconductorCO.,Ltd., which had seen a significant decline in business with the Samsung Group following a patent lawsuit with a SamsungElectronics subsidiary, has drawn attention by signing a large-scale contract with a Samsung affiliate.

HANMISemiconductorCO.,Ltd.(042700)announced on the 6th that it had received an order worth 24.48 billion won from SamsungElectroMechanics for “Micro Saw & Vision Placement (MSVP)” equipment.

HANMISemiconductorCO.,Ltd. plans to prioritize on-time delivery and the quality of installation and setup to ensure there are no disruptions to SamsungElectroMechanics’ production schedule. Additionally, the company plans to enhance customer satisfaction by providing prompt service through dedicated after-sales service staff and vehicles to quickly address customer needs.

MSVP is HANMISemiconductorCO.,Ltd.’s core flagship equipment. Since launching the first-generation “VISION PLACEMENT” in 1998, HANMISemiconductorCO.,Ltd. has sourced SAW equipment from Japan’s DISCO. However, beginning in 2019, to reduce its reliance on equipment imports from Japan, the company became the first in Korea to domestically produce its own SAW brand, “micro SAW,” in 2021, and began aggressively expanding its market share in the semiconductor package saw (SAW) market. Five years later, HANMISemiconductorCO.,Ltd.’s MSVP equipment has been recognized for its competitiveness in the global market and has achieved the top global ranking.

The MSVP is an essential piece of semiconductor back-end equipment that combines “micro SAW,” which precisely cuts semiconductor packages, with “VISION PLACEMENT,” which cleans and dries them before performing vision inspection, sorting, and loading. It is used in a wide range of production processes, including DRAM, NAND flash, and HBM, as well as system semiconductors, printed circuit boards (PCBs), and glass substrates.

Founded in 1980, HANMISemiconductorCO.,Ltd. leads the global market for advanced semiconductor packaging equipment through continuous R&D and proprietary technologies. HANMISemiconductorCO.,Ltd. ranks first globally in the “TC bonder” equipment sector, which is essential for the production of HBM (High Bandwidth Memory), a core component of AI semiconductors. Recently, the company has successively launched a lineup of four types of 2.5D packaging equipment, which it supplies to global foundries and back-end (OSAT) companies. Its “EMI Shield” equipment, currently supplied to global aerospace companies, is also driving sustained revenue growth.

Kwak Dong-shin, Chairman of HANMISemiconductorCO.,Ltd., stated, “Based on our in-house core technologies for key process equipment and our vertically integrated manufacturing capabilities, HANMISemiconductorCO.,Ltd. has consistently supplied the high-precision, high-reliability equipment demanded by our customers.” He added, “We will prioritize customer satisfaction above all else and focus our efforts on delivering the core value our customers need.”