Business·Industry

Next-Generation AI Semiconductors Take Center Stage… Largest-Ever Semiconductor Expo Opens on the 14th

Samsung Unveils HBM and 3D Memory; INICS Corporation Unveils HBM4E and HBF 888 Booths Participate… Physical AI and Advanced Packaging Technologies Under One Roof

Choi Oh-hyun
2026-10-12 17:44:19
[Edaily Reporter Choi Oh-hyun ] SamsungElectronics and SK hynix are showcasing next-generation artificial intelligence (AI) semiconductor technology at South Korea’s largest semiconductor exhibition.
Visitors examine semiconductors at the “27th Semiconductor Expo” held at COEX in Gangnam-gu, Seoul, on October 22 of last year. (Photo by Reporter Lee Young-hoon)

The Korea Semiconductor Industry Association announced on the 12th that it will host “SEDEX 2026 (The 28th Semiconductor Expo)” for three days, from the 14th to the 16th, at COEX in Gangnam-gu, Seoul.

This year’s exhibition is themed “Toward the Era of Silicon Intelligence.” A total of 300 companies, including SamsungElectronics and SK hynix, will participate with 888 booths. With about 70 more participating companies and approximately 230 more booths than last year, this marks the largest-ever event.

SamsungElectronics will highlight “AI System Design” as its core message. The company will showcase HBM, mobile image sensors and processors, automotive semiconductors, and next-generation 3D memory technologies. It will also present comprehensive semiconductor solutions spanning everything from memory to system semiconductor design and production, foundry services, and advanced packaging.

SK hynix has designed its exhibition booth around the theme “An Unstoppable AI Journey.” The company will introduce HBM4E, the next-generation HBM, and High-Bandwidth Flash (HBF) technology. HBF is a next-generation memory technology based on NAND flash that increases data processing bandwidth. It will also exhibit key products such as DRAM and NAND for servers, PCs, and mobile devices, as well as solid-state drives (SSDs).

A large number of domestic semiconductor materials, components, and equipment companies will also participate. In the semiconductor design sector, ASICLAND Co.,Ltd., Chips&Media, Inc., and Openedges Technology, Inc. will be present. In the materials and components sector, DONGJIN SEMICHEM CO., LTD. and MiCo Ltd. will showcase their technological capabilities, while in the equipment sector, JUSUNG ENGINEERING Co.,Ltd., Semes, and PSK INC. will do the same. In the back-end processing and inspection sector, HANMISemiconductorCO.,Ltd. and Exicon Co., Ltd. will participate.

On the opening day, the 14th, SK hynix President Ahn Hyun will deliver a keynote speech titled “The Direction of Memory Innovation in the AI Era.” Shin Dong-ju, CEO of Mobilint, will present on physical AI semiconductors, and Professor Park Seung-bae of the State University of New York will speak on future computing technologies.

During the exhibition, events such as the International Conference on Advanced Packaging R&D, a seminar on semiconductor market outlook, and the JEDEC Global Standards Forum will be held. On the 16th, an event focused on semiconductors for humanoid robots will also take place. The job fair, running for two days starting on the 15th, is expected to draw 18 semiconductor companies and 433 job seekers.

Park Geon-soo, Vice Chairman of the Korea Semiconductor Industry Association, said, “Semiconductors are the core foundation supporting an era in which AI is expanding into the real world,” adding, “I hope students and job seekers will visit the exhibition hall to experience firsthand the reality of the Silicon Intelligence era.”

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