[Edaily Reporter JAEMIN SONG ] LG Innotek President Moon Hyuk-soo stated on the 13th regarding the flip-chip ball grid array (FC-BGA) business, “We are continuing to pursue long-term supply agreements (LTAs), and the situation is expected to improve starting next year.”

President Moon made these remarks while speaking with reporters as he toured the exhibition hall following the opening ceremony of “Korea Electronics Show (KES) 2026” held at COEX in Gangnam-gu, Seoul, that day, in response to a question about the status of FC-BGA supply contracts with major global tech companies. When asked to name specific clients, he remained tight-lipped, saying, “They are companies you all know.”

FC-BGA is a high-value semiconductor substrate that connects semiconductor chips to motherboards and is used in graphics processing units (GPUs) and central processing units (CPUs) for artificial intelligence (AI) servers. Since entering the FC-BGA business in 2022, LG Innotek has been expanding its business scope to include high-value products for AI servers. Following the mass production of FC-BGA for AI server networks in the second half of this year, the company plans to begin mass production of FC-BGA for AI server training and inference next year.

The company has set 2028 as the target date for supplying next-generation semiconductor glass substrates. President Moon explained, “We are operating a pilot (pre-production) line at our Gumi plant,” adding, “We are still in the development phase and have not yet reached the supply stage.”

Glass substrates are next-generation semiconductor substrates that use glass instead of conventional plastic materials to reduce thermal deformation and facilitate the implementation of fine circuits. Since officially announcing its plans to pursue the glass substrate business in 2024, LG Innotek has established a pilot line at its Gumi plant and has been advancing technology development. Earlier this year, at “CES 2026” held in Las Vegas, the company also announced its plan to continue research, development, and investment in glass substrates. However, regarding the robotics components business, the company remained tight-lipped, stating that it is “still in the research and development (R&D) stage.”

Additionally, after touring the exhibition hall, President Moon remarked, “It seems that Korean companies have significantly advanced in their application of AI technology.”

Meanwhile, LG Innotek set up an exhibition booth at the Korea Electronics Show for the first time in 10 years, since 2016. As a vice-chairman company of the Korea Electronics and Information Technology Industry Promotion Agency (KEA), LG Innotek showcased key technologies such as automotive electronic components and semiconductor substrates at this exhibition. Regarding the reason for setting up a large-scale booth, President Moon smiled and said, “The organizers asked us to make it big.”

At the 21st “Electronics & IT Day” commemorative ceremony held on the same day, Jo Ji-tae, Executive Vice President and Head of the Package Solutions Business Division at LG Innotek, received the Silver Tower Order of Industrial Service Merit. Executive Vice President Jo was recognized for his contributions to the development of the domestic electronics and IT industry through strengthening the competitiveness of the semiconductor substrate business, driving production innovation, and localizing core equipment.