[Edaily Reporter Kim Ah-reum] HNS Hi-Tech, a KOSDAQ-listed small and medium-sized enterprise specializing in display materials, is accelerating its transformation into a semiconductor packaging materials company.

HNS Hi-Tech, a company specializing in display bonding materials and electronic components, announced on the 15th that it has secured core proprietary technology for "build-up film," a substrate material that reduces power loss during the current flow process in semiconductor packaging, and is accelerating its commercialization efforts. As of the end of last year, this substrate material market was valued at 1 trillion won globally and is currently monopolized by Japan’s Ajinomoto.

HNS Hi-Tech is currently in discussions with clients regarding process evaluations and expects to quickly capture this market once it enters global mass production. HNS Hi-Tech stated that it began joint development with the Korea Electronics Technology Institute (KETI) for a three-year period from May 1, 2023, to April 30 of this year, and has recently succeeded in securing basic physical properties comparable to or superior to those of Ajinomoto’s products. The material currently under development can be applied not only to semiconductor packaging substrates but also to chipsets for ultra-high-speed interface processes in high-performance computing, as well as ultra-small circuits for mobile application processors (APs) in smartphones and other mobile devices, making it suitable for semiconductor manufacturing and the production of various IT and mobile products.

HNS Hi-Tech also showcased its PMF (Electrode Matching Conductive Film) technology and products for semiconductors at the "2026 Society for Information Display (SID 2026)," the world’s largest display exhibition, held at the Los Angeles Convention Center from the 5th to the 7th of last month. PMF is described as a new-generation technology applicable not only to high-resolution display products but also to semiconductor packaging, capable of replacing the metal bumps used to electrically connect "chip-to-chip" or "substrate-to-substrate" in existing semiconductor materials.

Kim Jeong-hee, CEO of HNS Hi-Tech, stated, “While we have established ourselves as a global display materials company over the past 30 years since our founding in 1995, we now plan to focus our efforts on transforming into a full-fledged semiconductor packaging materials company based on the technology and experience we have accumulated.”