KOSDAQ

J&T C Develops World’s First 2.0mm-Thick TGV Glass Substrate

Strengthening Technological Cooperation with Taiwan, Japan, and Others Aiming for Mass Production for a Global Integrated Semiconductor Customer Based in the U.S.

[Edaily Reporter Lee Hye-ra] #J&TC announced on the 19th that it has successfully developed the world’s first 2.0mmT TGV glass substrate.
J&TC’s 2.0mmT TGV glass substrate. (Photo courtesy of J&TC)

The company now offers a diverse product lineup with glass thicknesses ranging from a minimum of 0.3mmT to a maximum of 2.0mmT.
The company stated that it has already received validation from some Taiwanese and South Korean substrate manufacturers, and that validation is currently underway with a Japanese manufacturer. The company reported that it has already begun developing a 3.0mmT glass substrate as its next new product, skipping the intermediate stages. The TGV glass substrates manufactured by J&T&C are significant in that they have received “Crack-Free” certification following rigorous reliability testing by substrate manufacturers regarding micro-cracks in the glass.
Since entering the semiconductor glass substrate business in 2024, J&T C is currently participating in new projects for two of the world’s largest integrated semiconductor companies. Last year, the company completed vertical integration across all production processes by merging with its subsidiary “COMET,” which specializes in plating and etching processes. By incorporating this core technology into equipment manufactured in-house by its affiliate, Jinwoo Engineering, J&T C significantly strengthened its quality and cost competitiveness, establishing Korea’s first TGV mass production line in October of last year.
A J&T&C official stated, “Based on this technological capability, we have been conducting various projects and evaluations with top-tier global semiconductor companies, as well as substrate manufacturers in Greater China, Japan, Europe, and South Korea, in preparation for mass production next year. We have already entered the business implementation phase following the signing of an MOU with a major South Korean conglomerate at the end of May.” “Additionally, we are scheduled to sign another contract next month with a global substrate manufacturer based in Japan, and we will sequentially announce details regarding future new contracts,” the official added.
Cho Nam-hyuk, CEO of J&T C, stated, “The TGV glass substrate business is a major mid- to long-term growth engine for J&T C. With our advanced technology, superior quality, and cost competitiveness, our company will secure a very important position as a leading global provider of cutting-edge materials in the AI-centric semiconductor market.”

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