[Edaily Reporter Kim Se-yeon ] HANMISemiconductorCO.,Ltd.(042700), which has dominated the high-bandwidth memory (HBM) equipment market, is set to expand its presence in the system semiconductor equipment market in earnest. The company plans to increase its revenue by introducing advanced packaging technologies into the system semiconductor sector.

HANMISemiconductorCO.,Ltd. announced on the 26th that it has launched the “FC Bonder 3.5,” a new piece of equipment for artificial intelligence (AI) system semiconductors, and will supply it to global foundries and back-end (OSAT) companies.
HANMISemiconductorCO.,Ltd. has focused on the 2.5D packaging market (an advanced assembly technology that connects multiple semiconductor chips as a single unit), which is experiencing explosive growth due to the surge in demand for AI semiconductors. Following the launch of the “FC Bonder 75” last year, the company has now introduced the “FC Bonder 3.5.”
HANMISemiconductorCO.,Ltd.’s “FC Bonder 3.5” meets the latest process standards required by global AI semiconductor companies. First, productivity and precision have been significantly improved compared to competitors. Additionally, by applying technology that attaches multiple semiconductor chips to a wafer in the 2.5D packaging process, it can handle large semiconductors and substrates up to 340 mm in size.
The “FC Bonder 3.5” supports not only flip-chip bonding—where semiconductor chips are bonded upside down—but also conventional bonding using adhesive film (DAF), allowing for flexible use tailored to each customer’s production process.
Currently, global tech giants such as NVIDIA, AMD, Broadcom, Marvell, and Apple have adopted the 2.5D packaging process for the production of their AI chips. As a result, it has established itself as a core technology in the fields of AI semiconductors and high-performance computing (HPC).
HANMISemiconductorCO.,Ltd. official stated, “Building on our proven bonding technology demonstrated with HBM TC bonders, we will achieve results that significantly contribute to revenue in the new 2.5D packaging market,” adding, “We will continue to introduce cutting-edge packaging solutions required for the AI semiconductor era.”
Meanwhile, alongside expanding its product portfolio, HANMISemiconductorCO.,Ltd. plans to significantly strengthen its local sales and customer support capabilities by establishing “Hanmi USA,” its U.S. subsidiary, by the end of this year. This strategy aims to comprehensively expand its customer base in the U.S. market, which is home to numerous global big tech companies.