[Edaily Reporter SOYEON KIM ] SamsungElectroMechanics announced on the 2nd that it has signed a definitive joint venture (JV) agreement with Dongwoo Hainchem CO.,LTD, a wholly-owned subsidiary of Japan’s Sumitomo Chemical Group, to produce “Glass Core,” a key material for glass substrates. The establishment of this joint venture is a strategic move to secure a leading position in the glass substrate market, which is considered a game-changer in the artificial intelligence (AI) semiconductor market.

Through this agreement, the two companies have decided to establish the joint venture “GlaSSEM” (tentative name) and work to secure a competitive edge in core materials for glass substrates. The name of the joint venture, “GlaSSEM,” is an acronym that combines the meanings of “Glass,” “SamsungElectronics,” “Sumitomo,” “Electronic,” and “Materials.” It embodies the vision to lead the market for advanced glass materials for next-generation semiconductor packaging, leveraging the two companies’ differentiated material and process technologies.

The total investment by the two companies amounts to approximately 4800억 won. SamsungElectroMechanics holds a 66% stake, while Dongwoo HANCHEM CO.,LTD holds 34%. The joint venture’s headquarters and production facility will be established within Dongwoo HANCHEM CO.,LTD’s Pyeongtaek plant in Gyeonggi Province. Following the signing of this master agreement, the two companies plan to complete the necessary procedures and finalize the establishment of the joint venture by the end of the year.

The “glass core” produced by the joint venture is a key material for glass substrates, which are gaining attention as next-generation semiconductor substrates. Compared to conventional plastic (organic material) substrates, glass substrates have a lower coefficient of thermal expansion and superior flatness, making them ideal for large-area, high-density semiconductor packaging. In particular, the size of packages for high-performance semiconductors—such as those used in AI servers and high-performance computing (HPC)—is increasing, and the demand for finer circuit integration is growing. Consequently, glass substrates are expected to become the cornerstone of next-generation packaging technology and are anticipated to revolutionize the market.

Through the establishment of this joint venture, SamsungElectroMechanics plans to secure a stable manufacturing and supply base for “glass core”—a key material for glass substrates—and strengthen its competitiveness in the next-generation package substrate business. The company intends to accelerate the commercialization of glass substrates by combining SamsungElectroMechanics’ semiconductor substrate design and manufacturing capabilities with the Sumitomo Chemical Group’s material technology and Dongwoo HANCHEM CO.,LTD’s production infrastructure and operational know-how.

"GlaSSEM" plans to proceed in phases with the construction of production facilities, process stabilization, and quality verification, aiming to begin full-scale operations in the second half of next year. Through this, the company intends to proactively respond to the demand for glass substrates from major global tech companies.

SamsungElectroMechanics President Jang Deok-hyun stated, “The establishment of this joint venture is a strategic choice to proactively secure core competitiveness in glass cores,” adding, “We will maximize the synergy between the two companies to lead the paradigm shift in the next-generation semiconductor substrate market.”

Keiichi Iwata, Chairman of the Sumitomo Chemical Group, emphasized, “This collaboration will serve as an opportunity to further enhance both companies’ competitiveness in the field of advanced semiconductor materials,” adding, “We will continue our long-term partnership through ongoing technological cooperation.”