Issues & Trends

JNTC CO.,LTD. Signs Agreement with Japan’s TOPPAN to Commercialize TGV Glass Substrates… Expanding Global Supply Chain

Shin Ha-yeon
2026-07-13 14:07:03
[E-Daily Reporter Shin Ha-yeon ] JNTC CO.,LTD.(204270)has signed an agreement with Japanese semiconductor packaging company TOPPAN to commercialize TGV (Through Glass Via) glass substrates for next-generation semiconductor packaging, marking a step toward expanding its global supply chain.

According to JNTC CO.,LTD. on the 13th, the company signed an agreement with TOPPAN on the 6th to commercialize TGV glass substrates. This agreement follows the company’s recent achievement of successfully developing TGV glass substrates capable of accommodating glass thicknesses ranging from 0.3 mm to 2.0 mm—a world first.
The photo on the left shows the signing ceremony for the TGV glass substrate commercialization agreement. (From left) Akihiko Furuya, President of the Semiconductor Division, Electronics Business Unit at TOPPAN, and Cho Nam-hyuk, CEO of JNTC CO.,LTD. The photo on the right shows an image of JNTC CO.,LTD.’s 2.0mm TGV glass substrate product. (Photo = JNTC CO.,LTD.)

Having previously signed memorandums of understanding (MOUs) and non-disclosure agreements (NDAs) with global companies both domestically and internationally, the company plans to accelerate the full-scale commercialization of TGV glass substrates and the establishment of a global supply chain through this collaboration with TOPPAN.

In particular, the recently developed 2.0mm-thick product is made from a single 2.0mm-thick glass sheet, rather than the method currently under consideration in the industry of laminating two 1.0mm-thick glass substrates. The company explained that it has currently achieved a mass production yield of approximately 94% and has secured a competitive edge in key commercialization technologies, such as preventing micro-cracks, minimizing voids, and controlling warpage.

JNTC CO.,LTD. has established vertical integration across the entire TGV glass substrate production process in about two years since officially announcing its entry into the semiconductor glass substrate business in 2024. The company stated that the rapid acquisition of this technology was made possible by internalizing core tempered glass processes, including equipment manufacturing, plating, and laser etching and cutting.

Cho Nam-hyuk, CEO of JNTC CO.,LTD., said, “We are currently conducting various projects and evaluations with top-tier global semiconductor companies and semiconductor packaging firms in Japan, Europe, and Greater China, with the goal of beginning mass production in 2027,” and “To meet customer demand, we are also considering a strategic expansion of our mass production lines in Korea rather than in Vietnam, and we will strive to secure a leading position in the global market and drive standardization based on our 2.0mm TGV glass substrate technology.”

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