[Edaily Reporter Kwon Oh Seok ] MKElectron(033160)’s stock price is surging in early trading. It appears that buying interest is surging on the back of positive outlooks from the securities industry.

According to MP Doctor on the 5th, MKElectron is trading at 17,970 won as of 9:18 a.m., up 17.07% from the previous trading day.
Earlier that day, NH INVESTMENT & SECURITIES released a report forecasting that MKElectron would be a leading beneficiary of surging demand for bonding wires driven by the widespread adoption of SoCAMM2 memory for artificial intelligence (AI) servers. The firm assessed that the stock offers attractive valuation, noting that its price-to-earnings ratio (PER) stands at just 5 times based solely on its semiconductor division’s earnings. However, it did not provide an investment rating or target price.
Mok Jin-won, an analyst at NH INVESTMENT & SECURITIES, analyzed, “The essence of the benefits from SoCAMM2 lies in the fact that LPDDR (low-power memory), which was previously limited to mobile devices, is emerging as the core memory for ultra-high-performance AI servers, leading to a significant increase in demand for bonding wires,” adding, “The wire bonding market, which had been dismissed as a declining industry due to competition from advanced packaging, is making a comeback.”
He continued, “The adoption of SoCAMM2 modules is gaining momentum due to changes in data center architecture centered around NVIDIA’s Vera CPU racks,” explaining, “The spread of this trend marks a historic turning point in which the wire bonding process—which utilizes bonding wires—is being reevaluated as a core process for achieving high integration and high efficiency in the AI server memory ecosystem.”
In particular, he predicted that SoCAMM2’s high-stacking structure would significantly increase the use of bonding wires. Researcher Mok said, “As memory manufacturers consider plans to utilize 2GB dies with proven yield and mass-production capabilities, a 12-layer high-stacking structure is required to achieve the same capacity,” adding, “If the number of die stacking layers increases from 8 to 12, demand for bonding wires will surge by more than 50% per individual package.”
He also projected that earnings improvements will gain momentum. Researcher Mok analyzed, “On a consolidated basis, 2026 revenue is estimated to reach 2.0328 trillion won, a 44.8% increase year-over-year, while operating profit is projected to rise 774.4% to 124 billion won.” He added, “The semiconductor division alone is expected to post revenue of 1.795 trillion won and operating profit of 88 billion won (+185%).”