[Edaily Reporter Park Jung-Soo ] #Iron Device Corp., a fabless mixed-signal semiconductor company, unveiled an ultra-compact gallium nitride (GaN) power stage solution for humanoid robot joints at a global power electronics exhibition.
Iron Device Corp. announced on the 26th that it is participating in “PCIM Asia 2026,” taking place in Shenzhen, China, through the 28th, where it unveiled an ultra-compact GaN power stage solution for humanoid robot joints and a reliability verification set (Integrated BLDC Servo Actuator) demo.
The GaN Power Stage unveiled at the event is a power semiconductor that integrates a 100V half-bridge GaN device and a gate driver into a single package.
By applying FoWLP (Fan-out Wafer-Level Package) process technology optimized for heat dissipation, the company reduced power loss and minimized the product’s size. According to the company, it achieved a low on-resistance (RDS(on)) of 5.5 mΩ, thereby reducing heat generation and noise.
The company explained that this enables the miniaturization of quasi-direct-drive (QDD) actuators—key modules in robot joints—while improving power efficiency and ensuring drive reliability.
At this exhibition, Iron Device Corp. also unveiled a demonstration verifying heat management and performance under high-load and continuous operation conditions. Based on this, the company plans to expand the application of its products to global robotics and component manufacturers.
Currently, Iron Device Corp. is expanding the application areas of its high-performance GaN power stage solutions from humanoid robot joint actuators to high-degrees-of-freedom robot hands and physical AI devices. The company also plans to target markets requiring high-power, high-efficiency power control, such as AI data centers.
Seon Jeong-hyun, Vice President of Iron Device Corp., stated, “As the transition to the era of physical AI accelerates, the importance of power ICs for compound power devices—which simultaneously meet the requirements of miniaturization and high efficiency for next-generation DEVICES—is growing.” He added, “Based on our product competitiveness in terms of ultra-miniaturization, high integration, and low loss, we will accelerate our efforts to secure a leading position in high-value-added markets such as humanoid robots and AI data centers.”