Samsung Exynos 2700 Outperforms Qualcomm’s Top-Tier AP… Will It Prove the Competitiveness of 2-Nanometer Technology?
In-house Tests Show Up to 20% Lead in CPU and GPU Performance
Second-Generation 2-Nanometer Process to Be Adopted… Scheduled for Inclusion in Next Year’s Galaxy S27
Exynos Market Share Rises to 9%… Non-Memory Segment Expected to Rebound
[Edaily Reporter SOYEON KIM ] SamsungElectronics’ next-generation mobile application processor (AP), the “Exynos 2700,” has outperformed Qualcomm’s top-tier chipset in internal performance tests. With superior performance in both the central processing unit (CPU) and graphics processing unit (GPU), expectations are growing that SamsungElectronics will regain its competitiveness in the mobile AP market.
According to industry sources on the 25th, SamsungElectronics recently conducted internal benchmark tests using China’s Xiaomi “Xiaomi 18 Pro Max,” and the Exynos 2700 reportedly outperformed Qualcomm’s “Snapdragon 8 Elite Extreme 6th Gen.”
Qualcomm has released two APs for next-generation flagship smartphones: the top-tier “Snapdragon 8 Elite Extreme 6th Gen” and the lower-tier “Snapdragon 8 Elite 6th Gen.” These two products are installed in the Xiaomi 18 Pro Max and the Xiaomi 18 Pro, respectively.
The Exynos 2700 is a mobile AP currently under development by SamsungElectronics and serves as the core component that acts as the “brain” of a smartphone. It is scheduled to be featured in SamsungElectronics’ flagship “Galaxy S27” series, set to launch early next year. SamsungElectronics Exynos (Photo: SamsungElectronics) In internal performance tests, the Exynos 2700 outperformed Qualcomm’s top-tier products in both CPU and GPU performance. CPU multi-core performance was approximately 15–20% higher depending on the measurement criteria, and it showed a gap of up to 44% compared to lower-end models. GPU performance, which affects tasks such as running high-spec games, was also found to be approximately 5–20% higher than Qualcomm’s top-tier products.
The Exynos 2700 was designed by SamsungElectronics’ System LSI Business Division and is scheduled to be manufactured using “SF2P,” the second-generation 2-nanometer (nm, one-billionth of a meter) process developed by the Foundry Business Division. It is reported to reduce heat generation and boost performance by applying an improved Heat Path Block (HPB) packaging technology. Its predecessor, the Exynos 2600, was used in select models of the Galaxy S26 series and the Galaxy Z Flip 8.
The performance improvements of the Exynos 2700 are drawing attention as they align with SamsungElectronics’ recent trend of expanding its market share in the mobile AP sector. According to market research firm Counterpoint Research, Exynos’ market share in the global smartphone AP market, based on shipments, stood at 9% in the second quarter of this year, up 2 percentage points from the previous quarter (7%). Compared to the same period last year (6%), this represents a 3-percentage-point increase and marks the highest level since tracking began in 2024.
If the Exynos 2700 continues to demonstrate its competitiveness after commercialization, it is expected to bolster the earnings recovery of SamsungElectronics’ System LSI Business Division and Foundry Business Division. There are expectations that the System LSI Business Division will expand its presence in the premium AP market, while the Foundry Business Division will demonstrate its technical capabilities in the 2-nanometer process, laying the groundwork for securing additional clients. As improving profitability is a key challenge for both divisions, the commercial success of the Exynos 2700 is expected to be a critical factor in their future earnings recovery.
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