What's Next After HBM? Samsung Discusses the Future of AI Semiconductors with 1,000 Partners
“Semiconductor Tech Seminar” to Be Held Twice a Year Starting in 2019
Sharing Insights on Memory Technology Trends, Including HBM and Next-Generation Packaging
“Semiconductors Are Key to AI Innovation… Strengthening Collaboration Among Materials, Parts, and Equipment Suppliers”
[Edaily Reporter JAEMIN SONG ] SamsungElectronics shared its vision for the future of memory semiconductor and materials technologies in the age of artificial intelligence (AI) with approximately 1,000 executives and employees from its partner companies.
On the 10th, SamsungElectronics’ Device Solutions (DS) Division hosted the “2026 Semiconductor Tech Seminar” at the Suwon Win-Win Cooperation Academy. (Photo: SamsungElectronics) SamsungElectronics’ Device Solutions (DS) Division announced on the 13th that it had hosted the “2026 Semiconductor Tech Seminar” on the 10th at the Suwon Win-Win Cooperation Academy, inviting partners to attend.
The Semiconductor Tech Seminar is a shared growth program designed to share the latest technology trends and key insights with partner companies. SamsungElectronics has been holding the seminar twice a year since 2019, and approximately 1,000 executives and employees from partner companies attended this event both in person and online.
The seminar for the second half of this year was held under the themes “The Evolution and Future of Memory Semiconductor Technology in the AI Era” and “A Paradigm Shift in Materials Technology Amid Changes in Semiconductor Technology.” Amid rapidly growing demand for AI semiconductors, the event focused on supporting partner companies in incorporating industry changes into their technology development and business strategies.
Ji Hyun-ki, Vice President and Head of the Win-Win Cooperation Center at SamsungElectronics’ Device Solutions (DS) Division, speaks at the “2026 Semiconductor Tech Seminar” held at the Suwon Win-Win Cooperation Academy on the 10th. (Photo: SamsungElectronics) Hwang Cheol-sung, Distinguished Professor at Seoul National University, introduced structural changes in the global semiconductor industry and the memory technology roadmap. He highlighted the limits of high integration in DRAM and NAND flash and discussed next-generation device technologies to overcome them, while also explaining high-bandwidth memory (HBM) stacking and next-generation packaging technologies designed to resolve memory bottlenecks in AI systems.
Yoon Kim, Team Leader of the Materials Technology Team at SamsungElectronics Foundry, shared the challenges and development directions for materials technology across logic, DRAM, and NAND products. Team Leader Yoon Kim emphasized the need for active discussion and collaboration with partner companies in materials, components, and equipment, noting that not only new substances but also high-purity, high-quality functional materials can be considered part of the new materials category.
Ji Hyun-ki, Vice President and Head of the Win-Win Cooperation Center at SamsungElectronics’ Device Solutions (DS) Division, stated, “The semiconductor industry is the core driving force behind AI innovation, and without advances in semiconductors, the development of AI is impossible,” adding, “We will continue to carry out various activities to strengthen the technological capabilities of our partner companies.”
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