[Edaily Reporter Kim Hyung-il ] #LINCSOLUTION CO., LTD., a 3D printing-based smart manufacturing company, announced on the 4th that it has signed an agreement to carry out a government-funded research and development (R&D) project titled “Development of Next-Generation Heat Pump Miniaturization Technology.”

This project is being carried out as part of the “International Joint Research on Leading Energy Technologies” initiative supported by the Korea Institute of Energy Technology Evaluation and Planning (KETEP). The research period is three years, from July 2026 to June 2029, with a total R&D budget of 3.4 billion won. Chung-Ang University will serve as the lead institution, with LINCSOLUTION CO., LTD., Kookmin University, the Korea Institute of Machinery and Materials (KIMM), LGELECTRONICS, and Michigan State University in the U.S. participating.

LINCSOLUTION CO., LTD. is responsible for verifying the feasibility of applying additive manufacturing (3D printing) to the production processes of core heat pump components and assessing their mass-production potential. Through this, the team plans to standardize the manufacturing processes for core components and conduct long-term reliability evaluations and performance verification to lay the groundwork for commercialization.

LINCSOLUTION CO., LTD. explained that utilizing metal 3D printing technology allows for the integrated production of micro-channels and complex structures that are difficult to achieve with conventional manufacturing methods, which is advantageous for making heat pumps more compact and efficient. The developed technology is expected to be applied in various fields, including AI data center cooling, electric vehicle thermal management, heating, ventilation, and air conditioning (HVAC), and energy facilities.

Jeon Geun-sik, CEO of LINCSOLUTION CO., LTD., said, “Through international joint research, we will refine the mass production processes for high-efficiency components based on additive manufacturing and accelerate our entry into the AI data center cooling and future mobility thermal management markets.”