[E-Daily Reporter Shin Ha-yeon ] #PIE CO., LTD. will participate in “SEMICON Taiwan 2026,” held in Taiwan, to showcase inspection solutions for next-generation glass substrates and advanced packaging processes.

PIE CO., LTD., a provider of integrated solutions for intelligent manufacturing based on artificial intelligence (AI) software, announced on the 2nd that it will participate in SEMICON Taiwan 2026, taking place at the Taipei Nangang Exhibition Center (TaiNEX) in Taiwan through the 4th.

At this exhibition, PIE CO., LTD. will showcase technologies centered on equipment that inspects micro-defects in glass substrates and semiconductor stacking processes. Key products include △High-resolution TGV (Through Glass Via) Automated Optical Inspection (AOI) △Glass substrate holotomography inspection equipment △X-ray CT and ultrasonic inspection systems.

The high-resolution TGV AOI utilizes multi-focus inspection technology to analyze glass substrate holes from the top to the center to the bottom. The holographic tomography inspection equipment analyzes changes in refractive index to detect material uniformity, microcracks, and voids, while the X-ray CT and ultrasonic inspection systems non-destructively inspect the copper fill status inside the holes and the stacking status of semiconductor memory.

The company will also showcase inspection technologies for advanced packaging processes. It will introduce solutions that inspect the hole diameters and internal contaminants in PTHs (Plated Through Holes) that pass through CCL substrates, as well as BVHs (Blind Via Holes) formed on ABF (Ajinomoto Build-up Film) and PPG (Prepreg).

Through this exhibition, PIE CO., LTD. plans to expand its network with local Taiwanese foundries, global semiconductor back-end outsourcing companies (OSATs), and high-performance substrate manufacturers, while seeking new business opportunities.

Choi Jeong-il, CEO of PIE CO., LTD., stated, “SEMICON Taiwan 2026 will serve as a crucial momentum to establish PIE CO., LTD.’s inspection solutions in the global market at a time when the global semiconductor technology paradigm is shifting toward next-generation materials and advanced packaging.” He added, “Starting with strengthening local partnerships in Taiwan, we will further solidify our leadership in the high-precision inspection market within the global AI semiconductor and advanced packaging sectors.”