[Edaily Reporter Lee Hye-ra] #SMAC announced on the 15th that it has signed a Memorandum of Understanding (MOU) with VDS to collaborate on joint research and development, demonstration, and commercialization in the fields of semiconductor equipment, precision drive modules, and physical AI autonomous manufacturing solutions.

The core of this agreement is the joint development of equipment and core modules for semiconductor front-end, back-end, and analysis processes by combining the two companies’ expertise in equipment design and manufacturing, precision drive systems, control and automation, and application technologies. The two companies plan to expand their collaboration to include precision reducers and actuators applicable to robotic and machine tool automation cells, as well as physical AI-based autonomous manufacturing solutions.
VDS is a technology company specializing in the development of high-ratio precision reducers for robots and core modules for semiconductor equipment. Earlier this year, it was recognized as an outstanding company in the TIPS (Private Investment-Led Technology Startup Support) program led by the Small and Medium Business Administration, and was recently selected to participate in a project led by the Ministry of Trade, Industry and Energy to develop actuators for humanoids.
In particular, the company is distinguished by its ownership of foundational patents for high-reduction-ratio precision reducer technology based on its proprietary tooth profile design theory. It is expanding its business scope from logistics robots, humanoids, and automotive/defense drive units to the field of head modules for semiconductor equipment. Based on high-speed, high-precision module design technology required for semiconductor front-end and back-end processes as well as 3D packaging processes, the company is also pursuing the development of sub-micron-level ultra-precision, high-rigidity stage modules, core mechanical modules for CMP, and core modules for bonding.
Through this agreement, SMAC plans to expand its capabilities in machine tools, automation, robotics, and control technology into the fields of semiconductor equipment and precision drive systems. The two companies will pursue the joint development and commercialization of units, modules, and equipment for semiconductor front-end and back-end processes, and plan to integrate VDS’s precision drive and head module technologies into the advanced semiconductor analysis and cleaning equipment currently being developed by SMAC. In particular, they plan to collaborate on high-precision position control, load control, vibration reduction, and modular design to establish a joint commercialization model that goes beyond the simple supply of parts.
Kwon Oh-hyuk, CEO of SMAC, stated, “This collaboration will serve as a crucial turning point for SMAC to evolve from a smart factory supplier based on machine tools and robots into a physical AI autonomous manufacturing platform company that integrates semiconductor equipment, precision drive, and robotic automation technologies.” “By combining SMAC’s capabilities in equipment manufacturing, automation, and control with VDS’s precision drive and core semiconductor module technologies, we will deliver tangible results that our customers can experience firsthand,” he added.