[Edaily Reporter Kim Hyun-ah ] The Korea Institute of Science and Technology (KIST) has launched the “AI Data Center Thermal Management Council” to secure competitiveness in data center thermal management technology, which has emerged as a key infrastructure in the AI era.

KIST announced on the 23rd that it held the “2026 AI Data Center Thermal Management Council Inauguration and Commemorative Symposium” at its headquarters in Seongbuk-gu, Seoul, officially launching a collaborative framework among industry, academia, and research institutions.

Approximately 300 experts from more than 45 organizations participated in the council, including SamsungElectronics(005930), SK hynix(000660), LGELECTRONICS(066570), as well as Seoul National University, Yonsei University, Sungkyunkwan University, and the Electronics and Telecommunications Research Institute (ETRI).

As the importance of AI data centers grows with the proliferation of generative AI and hyper-scale AI services, thermal management technology is emerging as a key competitive factor due to the increased heat generated by high-performance AI semiconductors such as GPUs and HBM.

The council plans to promote the standardization of high-efficiency, high-reliability thermal management technologies for AI data centers, establish technology roadmaps, develop testing and reliability standards, and carry out joint demonstration projects. The goal is to strengthen the domestic AI data center industry ecosystem through technological exchange across all fields, including materials, semiconductor packaging, and cooling systems.

At the symposium, trends in next-generation thermal management technologies were shared, including two-phase cooling, liquid immersion cooling, refrigerants for AI data centers, heat dissipation solutions for high-performance AI semiconductors, thermal interface materials, and packaging reliability.

Jang Jun-yeon, Vice President of KIST, stated, “As the performance of AI semiconductors improves rapidly, the importance of thermal management technology for stable operation is also growing,” adding, “I expect this council to serve as a focal point for cooperation that enhances the competitiveness of the domestic AI data center industry.”·

Professor Joo Young-chang of Seoul National University (former Director General of the Science and Technology Innovation Bureau at the Ministry of Science and ICT and President of the Korean Society of Microelectronic Packaging) emphasized, “Thermal management for AI data centers is an area that requires the convergence of technologies from various fields, including semiconductors, materials, machinery, and energy,” adding, “We must secure global competitiveness through standardization and joint demonstration projects based on collaboration among industry, academia, and research institutes.”