[Edaily Reporter Shin Ha-yeon ] #Mdevice Co., Ltd has obtained a technology patent to enhance the reliability of its high-bandwidth memory (HBM) manufacturing process.

Mdevice Co., Ltd, a semiconductor specialist, announced on the 1st that it had received a patent decision for its HBM manufacturing method. This technology involves first bonding a core die with a dielectric layer to a base wafer, then forming through-silicon vias (TSVs) on the core die to electrically connect it to the underlying stacked structure.

While conventional methods involve bonding after pre-forming TSVs and metal pads on the core die, this technology is characterized by a revised process sequence in which dielectric bonding is performed first, followed by TSV formation to complete the electrical connection.

The company explained that this approach reduces the burden of the “Cu Dishing” process for metal pads and addresses defect issues that can arise during the pre-formation of metal pads, such as oxide erosion, wafer warpage caused by high-temperature annealing, and cracks or seams resulting from variations in dishing depth and uniformity.

Since HBM is used as the core memory in high-performance computing systems such as AI accelerators, GPUs, HPC, and data centers, the company plans to gradually expand its capabilities to address the next-generation HBM and advanced packaging markets based on this patent.

In addition to developing advanced semiconductor packaging technologies, including HBM, Mdevice Co., Ltd is also expanding its drone business through its subsidiaries. Its subsidiary, Nepar, has developed a drone flight controller (FC) based on high-performance NXP microcontrollers (MCUs) and is currently discussing product implementation and supply plans with local companies to enter the Indonesian pest control drone market. The company is also submitting bids and conducting business negotiations in Taiwan’s defense and drone markets.

Financial performance also showed growth. Mdevice Co., Ltd.’s revenue for the first half of this year reached 48.6 billion won, a 7% increase compared to the same period last year, while operating profit rose 54% to 7.98 billion won.

Mdevice Co., Ltd. stated, “This patented technology is designed to address issues such as metal pad bonding and wafer warpage that can occur in existing HBM manufacturing processes, and to achieve more stable electrical connections in high-layer-count structures,” adding, “We plan to continue steadily strengthening our technological competitiveness in the fields of HBM and advanced semiconductor packaging.”