[Edaily Reporter Kim Hyung-il ] LB SEMICON(061970), a company specializing in semiconductor back-end processing (OSAT), announced on the 2nd that it has shipped its first products to Qualcomm. This marks an expansion of its portfolio from its existing business focused on display driver chips (DDIs) to non-DDI system semiconductors and power semiconductors.

LB SEMICON held a ceremony on August 31 at its headquarters in Pyeongtaek, Gyeonggi Province, to commemorate the first shipment of products to Qualcomm. The event was attended by LB SEMICON CEO Dae-gyo Lee and other executives, along with an executive in charge of operations at Qualcomm Korea and working-level staff from both companies, who discussed the progress and achievements of their collaboration, back-end technology and production capabilities, and the direction of their mid- to long-term partnership.

The collaboration between the two companies spanned approximately two years, beginning with discussions in the second half of 2024. LB SEMICON underwent technical reviews, Quality Management System (QMS) audits, reliability verification (qualification), and final inspection procedures prior to mass production. Based on this, the company began mass production in early August, leading to this first shipment.

To meet Qualcomm’s order volume, LB SEMICON established a dedicated production line and operated a specialized team involving relevant departments such as engineering, sourcing, production planning, and testing.

This shipment incorporates the company’s mass production capabilities for CPB (Cu Pillar Bump) bumps and its proprietary wafer-level packaging (WLP) technology. LB SEMICON explained that it possesses an integrated back-end process system—covering everything from bumping to wafer testing and back-end fabrication—as well as in-house testing capabilities.

The company also plans to expand its collaboration in the future. LB SEMICON identified the following as medium- to long-term goals: a phased expansion of production capacity to accommodate increased order volumes; obtaining additional certifications for new processes and products; and broadening its product portfolio. It also plans to continue mitigating risks to ensure stable supply, as well as improving yield and process efficiency.

LB SEMICON is investing in new bumping and back-end equipment using funds secured through a paid-in capital increase. The goal is to expand production capacity (Capa) in preparation for the volume increase expected starting in the second half of next year. LB SEMICON previously announced in August that it had received mass production approval from Qualcomm and had begun mass production of AI data center and automotive semiconductor products for Qualcomm.

Lee DAEKYO, CEO of LB SEMICON, stated, “This first shipment is not the end, but the beginning,” adding, “While building trust through consistent quality and on-time delivery, we will gradually expand the scope of our collaboration by increasing production capacity and obtaining additional certifications.”

Meanwhile, LB SEMICON is expanding its business portfolio beyond its existing DDI-centric structure to include non-DDI system semiconductors and power semiconductors. Following its participation as a back-end process supplier for Renesas’ power semiconductors, the company has now proceeded to mass production and shipment of products for Qualcomm.