[Edaily Reporter Shin Ha-yeon ] ASICLAND Co.,Ltd(445090), a company specializing in application-specific integrated circuit (ASIC) design solutions, will showcase its proprietary platform and cutting-edge semiconductor design and packaging technologies at a domestic semiconductor exhibition.

ASICLAND Co.,Ltd announced on the 14th that it will participate in “SEDEX 2026,” taking place at COEX in Seoul from the 14th to the 16th, to introduce its proprietary AI semiconductor design and verification platform “AxHub,” as well as its ASIC design and mass production turnkey services, TSMC’s leading-edge processes, and advanced packaging technologies.

AxHub is an integrated platform that supports the design and verification of customer-tailored AI semiconductors by pre-implementing key functions and semiconductor intellectual property (IP). It is currently under development with the goal of streamlining the development process to enhance design efficiency and reduce the time and cost required for product development.

The ASIC turnkey service supports the entire semiconductor development process—from establishing customer specifications to system-on-chip (SoC) design, verification, tape-out, packaging, testing, and mass production. At this exhibition, the company will also unveil actual chips and wafers jointly developed with clients in the AI and memory sectors.

As a partner in TSMC’s Value Chain Alliance (VCA), ASICLAND Co.,Ltd will also showcase its design capabilities in cutting-edge processes and advanced packaging. Key technologies on display include TSMC’s 2-nanometer (nm) “N2” process, which utilizes a nanosheet transistor structure, and “3DFabric,” an advanced packaging platform that incorporates 2.5-dimensional (2.5D) and 3-dimensional (3D) semiconductor integration technologies.

As demand for high-performance, low-power AI semiconductors grows, the importance of advanced process and packaging technologies is also increasing. The company is strengthening its related design and development capabilities, centered on its headquarters in South Korea and its research and development (R&D) center in Taiwan.

It is also expanding its collaboration with major clients. Following the signing of a contract with FADU INC. to develop enterprise solid-state drive (eSSD) controller solutions, ASICLAND Co.,Ltd secured a contract with SK hynix to support the design and tape-out of next-generation eSSD controllers. Based on this, the company plans to strengthen its business foundation so that new development projects can lead to subsequent mass production.

Lee Jong-min, CEO of ASICLAND Co.,Ltd, stated, “To turn our customers’ semiconductor development concepts into actual products, we need an approach that considers not only design but also manufacturing processes, packaging, and mass production.” He added, “Based on our proprietary platform and turnkey execution capabilities, we will work together with our customers to solve their product commercialization challenges and expand our collaboration as a long-term development and mass production partner.”

Meanwhile, SEDEX 2026, now in its 28th year, is a specialized semiconductor exhibition hosted by the Korea Semiconductor Industry Association. ASICLAND Co.,Ltd will showcase its key technologies and development achievements at Booth C255 in Hall C on the 3rd floor of COEX.