[Edaily Reporter KIM EUNG-TAE ] HANMISemiconductorCO.,Ltd.(042700)posted strong results for the third quarter of this year and is expected to set new records for annual revenue and operating profit this year. Analysts attribute this continued growth to an increase in overseas clients and expanded supply of new equipment, despite the impact of a weakening exchange rate.

HANMISemiconductorCO.,Ltd.(042700)announced on the 30th that it recorded revenue of 181 billion won and operating profit of 90.8 billion won in the third quarter of this year. Revenue increased by 8.9% year-over-year. Operating profit rose by 33.9% over the same period. The operating profit margin stood at approximately 50.2%, up 9.4 percentage points from the previous year (40.8%).
Third-quarter revenue continued to grow despite the impact of the won’s depreciation on foreign currency conversions and the deferral of revenue recognition for certain equipment to the fourth quarter. In the fourth quarter, the company is projected to post its highest-ever fourth-quarter revenue as the deferred equipment sales are reflected and equipment supply to overseas customers expands.
HANMISemiconductorCO.,Ltd. is expected to set a new record for revenue for the third consecutive year through this year. This is because global semiconductor companies are expected to expand their investments in high-bandwidth memory (HBM) and advanced artificial intelligence (AI) packaging next year as well.
HANMISemiconductorCO.,Ltd. plans to expand shareholder returns based on its robust earnings growth and high profitability. Following last year’s year-end dividend of 800 won per share, the company has announced that this year’s dividend will be at a record high.
HANMISemiconductorCO.,Ltd. forecasts that increased demand for TC bonders driven by the shift to higher-layer-count next-generation HBM, along with the mass production and supply of new TC and FC bonder equipment for large-area AI packaging processes, will serve as new growth engines.
The company is also focusing on expanding into overseas markets. Following the establishment of HANMISemiconductorCO.,Ltd. in Taiwan, HANMISemiconductorCO.,Ltd. in China, and HANMISemiconductorCO.,Ltd. in Singapore, HANMISemiconductorCO.,Ltd. established a local subsidiary, “Hanmi USA,” in San Jose, California, in October of this year, creating a foothold for expansion into the U.S. market. Building on this, the company plans to expand its HANMISemiconductorCO.,Ltd. stated, “Using Hanmi USA as a base, we will strengthen local technical support and secure new customers to actively target the emerging U.S. advanced packaging market,” adding, “Along with TC bonders for HBM, we will continue to drive mid- to long-term revenue growth by supplying customers with TC bonders and FC bonders for various AI packaging applications, MSVPs, and EMI shielding equipment for aerospace and smart devices for mass production.”