[Edaily Reporter JAEMIN SONG ] LGELECTRONICS has unveiled a modular solution that pre-assembles data center cooling equipment—such as pumps and piping—so that on-site installation requires only connecting the system to a chiller. The solution is designed to reduce the construction time and initial investment costs for artificial intelligence (AI) data centers while allowing for flexible scaling of cooling capacity in line with server expansion.

LGELECTRONICS announced on the 29th that it is participating in “Data Center World Asia (DCWA) 2026,” Asia’s largest data center exhibition, which opened in Singapore, to showcase solutions covering everything from thermal management to power and operations for AI data centers.

The “Hydronic Modular,” unveiled for the first time at this exhibition, is a product that integrates all equipment necessary for cooling—including pumps, valves, piping, and emergency buffer tanks—into a container compliant with International Organization for Standardization (ISO) specifications. It is prefabricated as a complete unit at the factory and then connected to the chiller unit on-site to operate the cooling system.

Previously, multiple pumps and pipes had to be welded and assembled on-site to deliver the chilled water produced by the chiller to the server room. The Hydronic Modular system streamlines this process, enabling rapid data center deployment. When adding servers, users can connect as many modules as needed, allowing for phased investments in line with demand.

Expanding the Product Line from Air-Cooled to Liquid-Cooled Systems

LGELECTRONICS also showcased an “air-cooled oil-free inverter turbo chiller” for data centers, featuring a magnetic bearing-based oil-free compressor. This product enhances cooling efficiency by reducing internal friction losses in the compressor and lowers energy consumption through refrigerant pre-cooling technology that utilizes external cold air.

The company also unveiled a fan wall unit (FWU) that supplies cool air to server rooms and exhausts heat. It supports the stable operation of ultra-large data centers by minimizing cooling variations between servers, even in high-heat environments.

The company also unveiled a lineup of liquid cooling products designed for high-density AI servers. LGELECTRONICS offers a range of cooling distribution units (CDUs) from 600 kilowatts (kW) to megawatts (MW), and at this exhibition, it showcased 1 MW and 2.6 MW models.

The CDU circulates coolant through cold plates in direct contact with graphics processing units (GPUs) and central processing units (CPUs) to dissipate heat generated by the chips. LGELECTRONICS’ 600 kW, 1 MW, and 2.6 MW CDU models have received quality certification from NVIDIA.

LGELECTRONICS is also developing immersion cooling technology, which involves directly submerging electronic devices—such as servers—in a special non-conductive coolant. The company plans to expand its business scope with a “chip-to-chiller” solution that connects everything from the chiller that produces cold water to the CDU and the cold plate that absorbs heat from the chips.

A “One LG” exhibition space was also set up to showcase the combined capabilities of LG Corp.’s affiliates. LG Energy Solution introduced battery backup units, energy storage systems (ESS), and battery solutions for uninterruptible power supplies (UPS). LG CNS showcased prefabricated modular data centers—in which servers and power/cooling equipment are pre-manufactured in modular form—as well as services for building and operating AI factories.

Lee Jae-sung, President of LGELECTRONICS’ ES Business Division, said, “By leading with total cooling solutions optimized for ultra-large AI data centers, we will emerge as a key partner in the global AI infrastructure market.”