[Edaily Reporter JAEMIN SONG ] LGELECTRONICS has unveiled a modular solution that pre-assembles data center cooling equipment—such as pumps and piping—so that on-site installation requires only connecting the units to a chiller. The solution is designed to reduce the construction time and initial investment costs for artificial intelligence (AI) data centers, while allowing for flexible expansion of cooling capacity in line with server growth.

LGELECTRONICS announced that it participated in “Data Center World Asia (DCWA) 2026,” Asia’s largest data center exhibition that opened in Singapore on the 29th, showcasing solutions that encompass everything from thermal management to power and operations for AI data centers.

The “Hydronic Modular,” unveiled for the first time at this exhibition, is a product that integrates all equipment necessary for cooling—including pumps, valves, piping, and emergency buffer tanks—into a container compliant with International Organization for Standardization (ISO) specifications. It is prefabricated as a complete unit at the factory and then connected to the chiller unit on-site to operate the cooling system.

Previously, multiple pumps and pipes had to be welded and assembled on-site to deliver the chilled water produced by the chiller to the server room. The Hydronic Modular system streamlines this process, enabling rapid data center deployment. When adding servers, modules can be connected as needed, allowing for phased investment based on demand.

Expanding the Product Line from Air-Cooled to Liquid-Cooled

LGELECTRONICS also exhibited an “air-cooled oil-free inverter turbo chiller” for data centers, featuring a magnetic bearing-based oil-free compressor. This product enhances cooling efficiency by reducing internal friction losses in the compressor and lowers energy consumption through refrigerant pre-cooling technology that utilizes external cold air.

The company also unveiled a fan wall unit (FWU) that supplies cool air to server rooms and exhausts heat. It minimizes cooling variations between servers even in high-heat environments, supporting the stable operation of ultra-large data centers.

The company also unveiled a lineup of liquid cooling products designed for high-density AI servers. LGELECTRONICS offers a range of cooling distribution units (CDUs) from 600 kilowatts (kW) to megawatts (MW), and at this exhibition, it showcased 1 MW and 2.6 MW models.

The CDU sends coolant to cold plates in direct contact with graphics processing units (GPUs) and central processing units (CPUs) to dissipate heat generated by the chips. LGELECTRONICS’ 600 kW, 1 MW, and 2.6 MW CDU models have received quality certification from NVIDIA.

LGELECTRONICS is also developing immersion cooling technology, which involves directly submerging electronic devices such as servers in a special non-conductive coolant. The company plans to expand its business scope with a “chip-to-chiller” solution that connects everything from chillers that produce cold water to CDUs and cold plates that absorb heat from the chips.

A “One LG” exhibition space was also set up to showcase the combined capabilities of the group’s affiliates. LG Energy Solution introduced battery backup units, energy storage systems (ESS), and battery solutions for uninterruptible power supplies (UPS). LG CNS showcased prefabricated modular data centers—in which servers and power/cooling equipment are pre-manufactured in modular form—as well as services for building and operating AI factories.

Lee Jae-sung, President and Head of the ES Business Division at LGELECTRONICS, said, “By leading with total cooling solutions optimized for ultra-large AI data centers, we will emerge as a key partner in the global AI infrastructure market.”