[Edaily Reporter SOYEON KIM ] SamsungElectronics will unveil the blueprint for the Yongin National Semiconductor Industrial Complex—a project involving an investment of approximately 360 trillion won—at the Semiconductor Expo (SEDEX) 2026, taking place at COEX in Seoul from the 14th to the 16th. The company will introduce the major production and R&D hubs of the Yongin Semiconductor Cluster along with its development plans, and will also showcase a wide range of next-generation artificial intelligence (AI) semiconductor technologies.

◇ Introducing the “Yongin Semiconductor Cluster” with a 360 Trillion Won Investment
At this exhibition, SamsungElectronics will establish a new “Semiconductor Cluster Zone” to introduce its plans for expanding semiconductor production infrastructure and its key hubs. Construction of the Yongin National Semiconductor Industrial Complex is proceeding with the goal of beginning site preparation and breaking ground in 2027, followed by the launch of the first production line in October 2029.

Approximately 70 materials, parts, and equipment (MPE) companies, as well as fabless companies, are expected to move into the complex. The vision is to build a semiconductor ecosystem where semiconductor manufacturing, R&D, and partner companies are organically connected. Living infrastructure—including roads, transportation, residential facilities, and cultural and commercial facilities—will also be expanded, which is expected to contribute to the revitalization of the local economy.

SEDEX is Korea’s largest semiconductor trade show, organized by the Korea Semiconductor Industry Association. This year, approximately 300 companies participated, representing the entire semiconductor industry, including memory, system semiconductors, and materials, components, and equipment.

SamsungElectronics’ Device Solutions (DS) Division has participated in SEDEX since 2012, showcasing its products and technologies to industry professionals and the general public. Last year, approximately 10,000 people visited the SamsungElectronics booth.

This year, SamsungElectronics’ exhibition theme is “Architecting AI Systems.” The company organized its exhibition space into six zones: △Next-Generation Technologies △Cloud AI △Edge AI △Physical AI △Semiconductor Cluster △Mutual Growth and Cooperation.

The company is also showcasing a wide range of high-performance memory for AI, including High Bandwidth Memory (HBM). Leveraging its integrated capabilities spanning memory and logic design, foundry services, and advanced packaging, SamsungElectronics is introducing semiconductor solutions tailored to various AI applications.

◇Unveiling zHBM and zNAND-O Mockups
In the memory sector, the company exhibited HBM4E—the next-generation HBM—and LPDDR-PIM, which integrates computing capabilities within the memory itself. It also unveiled mock-ups of zHBM, a 3D memory architecture that reduces the physical distance between computing devices and memory, and zNAND-O, a 3D NAND solution optimized for edge AI.

In the foundry sector, the company showcased an HBM4E base die manufactured using a 4-nanometer (nm; one-billionth of a meter) process, as well as “2.3D Cube-E”—an expandable, ultra-high-density packaging technology based on silicon bridges—and “3D Cube-H,” a 3D packaging technology. The company also displayed a prototype of a Co-Packaged Optics (CPO)-based optical interconnect, which converts electrical signals into optical signals to transmit data.

In the System LSI sector, the company introduced the “DIMM Solution,” a core chip solution that supports the stable operation of server memory modules, as well as the 200-megapixel image sensor “ISOCELL HPC” and the mobile application processor (AP) “Exynos 2600.”

In the “Mutual Growth Zone,” the company highlighted partner support programs and achievements in fostering mutual growth aimed at building a sustainable semiconductor ecosystem. SamsungElectronics has been promoting mutual growth with its partners for 45 years, since founding the “Hyupseonghoe,” a partner council, in 1981. Currently, the company supports its partners in various areas, including financial assistance, technology, human resources, and education.

Recently, the company has also been hosting the “DS Together” event to express gratitude for the dedication and cooperation of partner company employees. Starting this month, it will operate the “Win-Win Café,” providing a coffee truck at major partner company sites for two months, and plans to hold a “Movie Day” in December for approximately 30,000 partner company employees and their families.