[Edaily Reporter KIM AH-REUM ] HANMISemiconductorCO.,Ltd.(042700)announced on the 29th that Executive Director Kim Byung-seok was awarded the “Silver Tower Order of Industrial Service Merit,” a government honor, for his contributions to achieving the No. 1 global market share in HBM TC bonders and advancing the semiconductor industry supply chain.

The government awards ceremony, which included the Silver Tower Order of Industrial Service Merit, took place on the 28th at KINTEX in Goyang, Gyeonggi Province, as part of the opening ceremony for the “2026 Materials, Parts, and Equipment—Core Technology Expo.” HANMISemiconductorCO.,Ltd. holds the No. 1 global market share in the HBM TC bonder market.

Executive Director Kim Byung-seok was recognized for his contributions to HANMISemiconductorCO.,Ltd.’s achievement of the No. 1 global market share through the development of high-precision, high-efficiency TC bonder technology. In particular, his achievements include strengthening the competitiveness of the domestic materials, parts, and equipment industry and advancing the industrial supply chain. Executive Vice President Kim Byung-seok joined HANMISemiconductorCO.,Ltd. in 1991 and, after 35 years with the company, currently oversees TC bonder research and development as head of the Hardware Division. He has enhanced HANMISemiconductorCO.,Ltd.’s equipment competitiveness by developing core technologies necessary for high-layer stacking and precision bonding of HBM.

Kim Byung-seok, Senior Vice President of HANMISemiconductorCO.,Ltd., stated, “This award was made possible by the passion and dedication of my colleagues who have worked alongside me to develop TC bonder technology,” adding, “I will continue to devote myself to developing high-precision, high-efficiency equipment technologies to enhance HANMISemiconductorCO.,Ltd.’s global competitiveness.”